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Applications

Semiconductors and High Density Interconnects

In order to fully utilize technology advancements of IC’s, the interface between circuit and other electronics must be improved by allowing an increased number of interconnecting points. NIL technology can provide finer imprint of structures to interconnects, as well as simplify present manufacturing processes, and hence reduce associated costs.

 

Following products are applicable in this area:

For more information please contact Obducat Sales
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