The standard configuration of Sindre® includes three embedded proprietary technologies:
Soft Press®
With Obducat Soft Press® technology pressure is applied to the stamp and substrate using compressed air, ensuring pressure uniformity over the entire imprint area. This allows stamp and substrate to conform to each other, eliminating negative effects from thickness variations, bow or waviness in stamp or substrate. Soft Press® enables thin and uniform residual layer over large areas, which is critical for high-resolution printing and pattern transfer fidelity.
STU®
The proprietary Simultaneous Thermal and UV (STU®) technology enables simultaneously combined thermal and UV nano imprint lithography, allowing the complete imprint sequence into UV-curable thermoplastic pre-polymers to be performed at a constant temperature. By using the unique STU® technology, problems related to thermal expansion mismatch between stamp and substrate are avoided. In the STU® process spin-coatable polymers are used, allowing control of the initial polymer thickness and homogeneity, essential for achieving thin and uniform residual layers.
IPS®
The patented Intermediate Polymer Stamp (IPS®) technology enables contamination control and increases the master stamp lifetime through a two-step process where the contact between the master stamp and the target substrate is avoided. Instead, the master stamp is replicated into a soft intermediate polymer stamp that transfers the structures into the target substrate. |
