Key Technologies

With Obducat SoftPress® technology, pressure is applied to the stamp and substrate using compressed air, ensuring pressure uniformity over the entire imprint area. This allows stamp and substrate to conform to each other, eliminating negative effects from thickness variations, bow or waviness in stamp or substrate. SoftPress® enables thin and uniform residual layer over large areas, which is critical for high-resolution printing and pattern transfer fidelity.

IPS® - Intermediate Polymer Stamp 

The patented Intermediate Polymer Stamp, IPS®, enables contamination control and increases the stamp lifetime through a two-step process where the contact between the hard master stamp and the hard substrate is avoided. Instead, the master stamp is replicated into a soft intermediate polymer stamp that transfers the structures into the target substrate. The IPS® technology therefore greatly impacts the overall costs associated with NIL, making the Obducat solution the most cost efficient on the market.  

STU® - Simultaneous Thermal and UV
Obducat’s proprietary STU® technology enables simultaneously combined UV and thermal NIL, allowing the complete imprint sequence into UV-curable thermoplastic pre-polymers to be performed at a constant temperature. The method has been developed in order to overcome problems related to different thermal expansions in stamp and substrate materials. The method allows the use of spin-coated UV-curable polymers with a homogeneous thickness distribution on wafer scale, crucial for CD control and enabling pattern transfer to an underlying substrate.