SINDRE® - Nano Imprint Lithography system for Production

Fully automated 

The SINDRE® 400 / 600 / 800 Nano Imprint Lithography (NIL) systems are designed for fully automated high volume production, using Obducat's proprietary IPS®/STU® process. 

Cost efficiency and contamination control is obtained through hands-off operation and a sophisticated cassette-to-cassette handling procedure. The high throughput and yield enables an unsurpassed efficient cost of ownership. The standard configuration of the systems generates a throughput of 30 wafers per hour.

VIDEO ELEMENT HERE

Semi-automated

The SINDRE® 60 Nano Imprint Lithography (NIL) system is designed for semi-automated production,  using Obducat's proprietary IPS®/STU® process. The system generates a throughput of 12 imprinted cycles per hour.

  SINDRE® 60 SINDRE® 400 SINDRE® 600 SINDRE® 800
Imprint Area Up to 6" 2", 3", 4" Up to 6" Up to 8"
Throughput 12 imprint cycles/hour 30 wph 30 wph 30 wph
Clean-room Compatibility Class 100 Class 100 Class 100 Class 100
Mini Environment Class 10 Class 10 Class 10 Class 10
Substrate Handling Semi-automated Cassette-to-cassette Cassette-to-cassette Cassette-to-cassette
Computer Controlled User interface Standard Standard Standard Standard
STU® Standard Standard Standard Standard
IPS® Standard Standard Standard Standard

For more information, please contact sales@remove-this.obducat.remove-this.com

The standard configuration of SINDRE® includes three embedded proprietary technologies:

SoftPress®
With Obducat SoftPress® technology pressure is applied to the stamp and substrate using compressed air, ensuring pressure uniformity over the entire imprint area. This allows stamp and substrate to conform to each other, eliminating negative effects from thickness variations, bow or waviness in stamp or substrate. SoftPress® enables thin and uniform residual layer over large areas, which is critical for high-resolution printing and pattern transfer fidelity.

STU®
The proprietary Simultaneous Thermal and UV (STU®) technology enables simultaneously combined thermal and UV nano imprint lithography, allowing the complete imprint sequence into UV-curable thermoplastic pre-polymers to be performed at a constant temperature. By using the unique STU®technology, problems related to thermal expansion mismatch between stamp and substrate are avoided. In the STU® process spin-coatable polymers are used, allowing control of the initial polymer thickness and homogeneity, essential for achieving thin and uniform residual layers.

IPS®
The patented Intermediate Polymer Stamp (IPS®) technology enables contamination control and increases the master stamp lifetime through a two-step process where the contact between the master stamp and the target substrate is avoided. Instead, the master stamp is replicated into a soft intermediate polymer stamp that transfers the structures into the target substrate.