The SINDRE® 400 / 600 / 800 Nano Imprint Lithography (NIL) systems are designed for fully automated high volume production, using Obducat's proprietary IPS®/STU® process.
Cost efficiency and contamination control is obtained through hands-off operation and a sophisticated cassette-to-cassette handling procedure. The high throughput and yield enables an unsurpassed efficient cost of ownership. The standard configuration of the systems generates a throughput of 30 wafers per hour.
The SINDRE® 60 Nano Imprint Lithography (NIL) system is designed for semi-automated production, using Obducat's proprietary IPS®/STU® process. The system generates a throughput of 12 imprinted cycles per hour.
|SINDRE® 60||SINDRE® 400||SINDRE® 600||SINDRE® 800|
|Imprint Area||Up to 6"||2", 3", 4"||Up to 6"||Up to 8"|
|Throughput||12 imprint cycles/hour||30 wph||30 wph||30 wph|
|Clean-room Compatibility||Class 100||Class 100||Class 100||Class 100|
|Mini Environment||Class 10||Class 10||Class 10||Class 10|
|Computer Controlled User interface||Standard||Standard||Standard||Standard|
The standard configuration of SINDRE® includes three embedded proprietary technologies:
With Obducat SoftPress® technology pressure is applied to the stamp and substrate using compressed air, ensuring pressure uniformity over the entire imprint area. This allows stamp and substrate to conform to each other, eliminating negative effects from thickness variations, bow or waviness in stamp or substrate. SoftPress® enables thin and uniform residual layer over large areas, which is critical for high-resolution printing and pattern transfer fidelity.
The proprietary Simultaneous Thermal and UV (STU®) technology enables simultaneously combined thermal and UV nano imprint lithography, allowing the complete imprint sequence into UV-curable thermoplastic pre-polymers to be performed at a constant temperature. By using the unique STU®technology, problems related to thermal expansion mismatch between stamp and substrate are avoided. In the STU® process spin-coatable polymers are used, allowing control of the initial polymer thickness and homogeneity, essential for achieving thin and uniform residual layers.
The patented Intermediate Polymer Stamp (IPS®) technology enables contamination control and increases the master stamp lifetime through a two-step process where the contact between the master stamp and the target substrate is avoided. Instead, the master stamp is replicated into a soft intermediate polymer stamp that transfers the structures into the target substrate.