More about the product

Priming (HMDS)

Resist deposition

  • Closed cover spin coating using our process approved Rotation Covered Chuck Technology (RCCT™)
  • Open bowl spin coating
  • Spray coating

Developer with spray or puddle nozzle

Hotplates up to 450°C & cool plates

HMDS (vapor prime) hotplates

Wafer flip station

Simple change of chucks for different substrate sizes

100 % edge handling guaranteed

Option for MEMS, packaging, LED, compound semiconductor or square substrates, discrete devices

Smart EBR system for flat, square or cleaved edge cleaning