Being the first company to commercialize Nano Imprint Lithography (NIL), Obducat is today the market leader and has the largest installed base worldwide of NIL.
The SINDRE® 400 / 600 / 800 Nano Imprint Lithography (NIL) systems are designed for fully automated high volume production, using Obducat's proprietary IPS®/STU® process.
Cost efficiency and contamination control is obtained through hands-off operation and a sophisticated cassette-to-cassette handling procedure. The high throughput and yield enables an unsurpassed efficient cost of ownership. The standard configuration of the systems generates a throughput of 60 wafers per hour. The SINDRE® platform has a high degree of flexibility and there are big possibilities for adaption to customer-specific demands.
The EITRE® Nano Imprint Lithography (NIL) series offer a flexible and cost efficient lithography solution. The systems are suitable for Research & Development purposes allowing replication of patterns in the micro- and nanometer range.
EITRE® offers a complete range of imprint methods, including thermal NIL, hot embossing, UV NIL, as well as Obducat's proprietary Simultanous Thermal and UV (STU®) imprint process.
All Nano Imprint Lithography (NIL) systems from Obducat are equipped with full area thermal imprint, using the patented SoftPress® technology. The proprietary design of the heater, embedded in the substrate chuck, provides a homogeneous temperature distribution across the whole imprint area. The uniform heating and a wide range of temperature settings, makes it possible to use a wide range of imprint polymer.
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The wet processing systems are based on standardized platforms, which allows a wide range of individual configurations for processing and handling of fragile substrates used in the semiconductor-, MEMS, piezoMEMS, OLED display and similar industries as well as in R&D.
The product portfolio for wet processing equipment encompass spin or spray coating, baking, priming, developing, etching, substrate / post CMP cleaning, lift-off and stripping of various substrate sizes and materials. Additionally, the possibility of coating wafers on both sides can be offered as well which includes the possibility for 100% edge handling capability.