Our Technologies

NanoImprint Lithograhy (NIL)

Obducat’s strong technology portfolio and expertise in process know-how makes us the most capable supplier in the Nanoimprint Lithography (NIL) market today. The Obducat NIL-system are easy-to-operate  NIL tools suitable for industrial High Volume Manufacturing, product development as well as R&D within academia.

Illustrations, photos and specifications on this Website are not legally binding. Pictures could show standard equipment plus options.

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IPS®

Increases master stamp lifetime, reduces sensitivity to substrate contaminations and enables patterning on concave and/or convex surfaces…

SoftPress®

Ensures pressure uniformity over the entire imprint area and eliminates negative effects from substrate thickness variations, bow or waviness…

STU®

Reduces the process time which enables higher throughput and thereby lower Cost-of-Ownership…

Automated IPS® demolding

Safeguards a highly repeatable process result substrate-to-substrate as well as ensures the ability to maintain pattern fidelity which translates to higher yield levels…

Resist Processing

Resist processing technology is widely used within semiconductor manufacturing. By implementing technologies such as the revolutionary RCCT™, the high performing EBR or our multiple chuck solutions we offer highly competitive and cutting-edge resist processing systems to the marketplace. Obducat have developed several highly advanced technologies that our tools can be configured with to meet the individual customer requirements.

Illustrations, photos and specifications on this Website are not legally binding. Pictures could show standard equipment plus options.

RCC

RCCT

Obducat’s revolutionary Rotating Covered Chuck Technology (RCCT™) process enable industry leading uniformity across the entire substrate…

Extended Hot Plate temperature

Extended Hot Plate temperature

Our high temperature hot plates allow for temperatures up to 450°C to meet needs of specific process needs…

EBR

Obducat’s high performing Edge Bead Removal (EBR) technology is used to remove the build-up of material at the substrate edges after spin coating…

Multiple Chuck solutions

Multiple Chuck solutions

Obducat’s superior multiple chuck solutions for coating, developing, etching and cleaning allow for maximum versatility…

ECU and FFU

Environmental Control Unit (ECU) control the temperature and humidity in the processing area and Filter Fan Units (FFU) ensure a particle free environment…

Temperature controlled resist and chemical lines

Temperature controlled resist and chemical lines

Our temperature-controlled photoresist line enables a repeatable temperature level of the photoresist, the developer or chemicals substrate-to-substrate at point of dispense…

Inline film thickness measurement

In-situ film thickness measurement in real-time enables immediate quality control and yield monitoring…

Flood exposure - photoresist image reversal

Flood exposure – photoresist image reversal

The flood exposure module is used for photoresist image reversal often used for Lift-Off Processes.

Fully automatic module for double side coating

Fully automatic module for double side coating

An automatic wafer flip station enabling backside processing…

Connection to wafer fab Management Systems

Enables connection to various Manufacturing Execution System (MES).

Wet Processing

Various type of wet processes such as Etch, Clean, Lift-Off and Stripping are widely used within semiconductor manufacturing. With a unique competence and  versatile tool solutions we offer highly competitive and cutting-edge wet processing tools to the market. Obducat have developed several highly advanced technologies that our tools can be configured with to meet the individual customer requirements.

Illustrations, photos and specifications on this Website are not legally binding. Pictures could show standard equipment plus options.

Etch

Wet etch processes are used in device formation as well as in the metallization and packaging processes. Our dedicated Etch modules enables optimized…

Substrate cleaning

Our dedicated modules for substrate cleaning and drying offers state-of-the-art surface preparation capability which enables damage free cleaning…

Lift-Off

Lift-Off is a critical process step that can be used to create three-dimensional metal interconnects surrounded by air, known as air bridges,…