Our Technologies
Our Technologies
NanoImprint Lithograhy (NIL)
Obducat’s strong technology portfolio and expertise in process know-how makes us the most capable supplier in the Nanoimprint Lithography (NIL) market today. The Obducat NIL-system are easy-to-operate NIL tools suitable for industrial High Volume Manufacturing, product development as well as R&D within academia.
Illustrations, photos and specifications on this Website are not legally binding. Pictures could show standard equipment plus options.
IPS®
Increases master stamp lifetime, reduces sensitivity to substrate contaminations and enables patterning on concave and/or convex surfaces…
SoftPress®
Ensures pressure uniformity over the entire imprint area and eliminates negative effects from substrate thickness variations, bow or waviness…
STU®
Reduces the process time which enables higher throughput and thereby lower Cost-of-Ownership…
Automated IPS® demolding
Safeguards a highly repeatable process result substrate-to-substrate as well as ensures the ability to maintain pattern fidelity which translates to higher yield levels…
In-line IPS® resist coating
The in-line resist coating of the IPS, allows for a much wider selection of carrier film material as well as IPS resist material. The customer will have the possibility…
Resist Processing
Resist processing technology is widely used within semiconductor manufacturing. By implementing technologies such as the revolutionary RCCT™, the high performing EBR or our multiple chuck solutions we offer highly competitive and cutting-edge resist processing systems to the marketplace. Obducat have developed several highly advanced technologies that our tools can be configured with to meet the individual customer requirements.
Illustrations, photos and specifications on this Website are not legally binding. Pictures could show standard equipment plus options.
RCCT™
Obducat’s revolutionary Rotating Covered Chuck Technology (RCCT™) process enable industry leading uniformity across the entire substrate…
Extended Hot Plate temperature
Our high temperature hot plates allow for temperatures up to 450°C to meet needs of specific process needs…
EBR
Obducat’s high performing Edge Bead Removal (EBR) technology is used to remove the build-up of material at the substrate edges after spin coating…
Multiple Chuck solutions
Obducat’s superior multiple chuck solutions for coating, developing, etching and cleaning allow for maximum versatility…
ECU and FFU
Environmental Control Unit (ECU) control the temperature and humidity in the processing area and Filter Fan Units (FFU) ensure a particle free environment…
Temperature controlled resist and chemical lines
Our temperature-controlled photoresist line enables a repeatable temperature level of the photoresist, the developer or chemicals substrate-to-substrate at point of dispense…
Inline film thickness measurement
In-situ film thickness measurement in real-time enables immediate quality control and yield monitoring…
Flood exposure – photoresist image reversal
The flood exposure module is used for photoresist image reversal often used for Lift-Off Processes.
Fully automatic module for double side coating
An automatic wafer flip station enabling backside processing…
Connection to wafer fab Management Systems
Enables connection to various Manufacturing Execution System (MES).
Wet Processing
Various type of wet processes such as Etch, Clean, Lift-Off and Stripping are widely used within semiconductor manufacturing. With a unique competence and versatile tool solutions we offer highly competitive and cutting-edge wet processing tools to the market. Obducat have developed several highly advanced technologies that our tools can be configured with to meet the individual customer requirements.
Illustrations, photos and specifications on this Website are not legally binding. Pictures could show standard equipment plus options.
Etch
Wet etch processes are used in device formation as well as in the metallization and packaging processes. Our dedicated Etch modules enables optimized…
Substrate cleaning
Our dedicated modules for substrate cleaning and drying offers state-of-the-art surface preparation capability which enables damage free cleaning…
Lift-Off
Lift-Off is a critical process step that can be used to create three-dimensional metal interconnects surrounded by air, known as air bridges,…