Products & solutions

Products & solutions

MCT 200 / 300 WET

FULLY AUTOMATIC MICRO-CLUSTER TRACK (MCT) TOOL FOR WET ETCHING, LIFT-OFF & CLEANING

Obducat’s MCT WET modular tool provides excellent performance as a result of the embedded cutting-edge solutions derived from many years close cooperation with our customers.

This ensures that the system is prepared for current and future HVM requirements. The configuration flexibility of the MCT WET (200/300mm) makes it adaptable to processing requirements in a wide variety of applications such as LEDs, SiC components, 5G components, Si IC’s, MEMS, Opto-electronic, Photonic components and Advanced Packaging.

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Highlights

  • Suitable for High Volume Manufacturing (HVM)

  • High reliability, yield and uptime

  • Competitive Cost-of-Ownership

  • Highly configurable tool

  • Customization possible for specific customer process and throughput requirements

Substrate size

The system can handle substrate sizes from 2” to 12” Ø or 2” x 2“ to 9” x 9”.

Tool Configurations

The standard MCT WET configuration is equipped with an I/O station and an all axis robot system on a linear track. It can incorporate up to 10 modules configured for Etching, Lift-off, Cleaning or Thermal processing.

The Thermal processing units can be equipped with up to 8 temperature plates in a stacker – hot plates, cool plates & HMDS vapor prime hot plate. The hot plates have a programmable temperature range up to 300°C and are equipped with programmable proximity pins.

  • Easy to operate windows-based PC with 22” color touch screen

  • Unlimited process recipe / flow storage capacity plus USB port

  • Batch & process parameter tracking

  • Ethernet port

Tool Options

Piranha Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Reaction temperature on wafer > 100°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

  • Hot DI water rinse as an option

SC1 Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Chemical flows for NH4OH, H2O2 and H2O are independently adjustable

  • Heated H2O line to obtain a working temperature of 60° to 70°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

SC2 Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Chemical flows for HCl, H2O2 and H2O are independently adjustable

  • Heated H2O line to obtain a working temperature of 60° to 70°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

Solvent Clean
  • Application is delivered by a puddle or spray nozzle

  • Chemicals are delivered from pressurized canisters

  • Media flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

  • Compatible to most solvents

  • Some solvents can be applied with high pressure (e.g. NMP, DMSO)

Mechanical substrate cleaning
  • Brush scrubber – This uses rotating brushes and a pressing force. A special chuck design is used for front and backside scrubbing. A supplementary DI water line is used for rinsing. Smaller brushes are available for treating small pieces.

  • High pressure – For DI water or solvents. The recipe uses a programmable sweep movement of dispense arm. The pressure is adjustable from 10-180 bar. DI water can be re-ionized with CO2.

  • Megasonic nozzle – Energy transportation is done by DI water. The recipe uses a programmable sweep movement of dispense arm. The Megasonic can supply from 1 to 5MHz.

HF Clean / Etch
  • Application is delivered by a puddle nozzle

  • Chemicals are delivered from a pump (no pressurized canisters)

  • Chemical flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

Metal / Si Etch
  • Application is delivered by a puddle or spray nozzle

  • Chemicals mixing via atomizer nozzles or static mixer

  • Media supply either via pressurized canisters or via pumps

  • Media flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

  • Compatible with most acids and caustic mixtures

Extended Hot Plate temperature – up to 450°C

The extended high temperature hot plates are implemented to meet the requirements needed in processes such as:

  • Reflow

  • Pyrolysis

  • Final hard bake of protection layers

Temperature controlled chemical lines

When chemicals are supplied from the wafer fab or stored outside the cleanroom the temperatures are different to the cleanroom environment causing chemicals to react and perform differently with changes in temperature. This can result in processing variations. This option can ensure a repeatable temperature level of the chemical’s substrate-to-substrate at point of dispense.

Multiple Chuck solutions – Low contact, Bernoulli

Chuck solutions for etching & cleaning:

  • Standard wafers that are wet treated use low contact chucks, where the wafer is held in place by supporting pins. and centripetal force fixing it during the high-speed drying.

  • Squared substrates are held at the corners by alignment pins using low contact chucks. The advantage of this chuck is the entire backside can be rinsed.

  • If the backside must be protected against aggressive (etching) medias, a Bernoulli chuck can be used. This chuck blows nitrogen which protects the entire backside against chemicals. Alignment pins hold the wafer in place and enables high spin acceleration.

  • If alignment pins are not allowed, a venturi chuck can be used instead. Nitrogen is injected into the chuck, creating a vacuum in the chuck center by mean of an integrated Venturi nozzle. The nitrogen blows out close to the wafer backside edges. This also protects the wafer backside against chemicals.

Connection to wafer fab Manufacturing Execution Systems

The tool can be configured to enable connection to various Manufacturing Execution System (MES) interfaces such as:

  • SECS / GEM

  • OPC/UA

  • Customer specific interfaces

Disclaimer: This product page/product description is subject to change without prior notice. Illustrations, photos and specifications on this Site/on this page are not legally binding. Pictures could show standard equipment plus options.