Products & solutions
Products & solutions
MCT 200 / 300 WET
FULLY AUTOMATIC MICRO-CLUSTER TRACK (MCT) TOOL FOR WET ETCHING, LIFT-OFF & CLEANING
Obducat’s MCT WET modular tool provides excellent performance as a result of the embedded cutting-edge solutions derived from many years close cooperation with our customers.
This ensures that the system is prepared for current and future HVM requirements. The configuration flexibility of the MCT WET (200/300mm) makes it adaptable to processing requirements in a wide variety of applications such as LEDs, SiC components, 5G components, Si IC’s, MEMS, Opto-electronic, Photonic components and Advanced Packaging.
Highlights
Suitable for High Volume Manufacturing (HVM)
High reliability, yield and uptime
Competitive Cost-of-Ownership
Highly configurable tool
Customization possible for specific customer process and throughput requirements
Substrate size
The system can handle substrate sizes from 2” to 12” Ø or 2” x 2“ to 9” x 9”.
Tool Configurations
The standard MCT WET configuration is equipped with an I/O station and an all axis robot system on a linear track. It can incorporate up to 10 modules configured for Etching, Lift-off, Cleaning or Thermal processing.
The Thermal processing units can be equipped with up to 8 temperature plates in a stacker – hot plates, cool plates & HMDS vapor prime hot plate. The hot plates have a programmable temperature range up to 300°C and are equipped with programmable proximity pins.
Easy to operate windows-based PC with 22” color touch screen
Unlimited process recipe / flow storage capacity plus USB port
Batch & process parameter tracking
Ethernet port
Tool Options
Piranha Clean
Application is delivered by an atomizer nozzle
Chemicals will be mixed in atomizer nozzle right at the point of use
Reaction temperature on wafer > 100°C
Chemicals are delivered from pressurized canisters
Recipe programmable sweep movement of dispense arm
Hot DI water rinse as an option
SC1 Clean
Application is delivered by an atomizer nozzle
Chemicals will be mixed in atomizer nozzle right at the point of use
Chemical flows for NH4OH, H2O2 and H2O are independently adjustable
Heated H2O line to obtain a working temperature of 60° to 70°C. Upon special request 80°C
Chemicals are delivered from pressurized canisters
Recipe programmable sweep movement of dispense arm
SC2 Clean
Application is delivered by an atomizer nozzle
Chemicals will be mixed in atomizer nozzle right at the point of use
Chemical flows for HCl, H2O2 and H2O are independently adjustable
Heated H2O line to obtain a working temperature of 60° to 70°C. Upon special request 80°C
Chemicals are delivered from pressurized canisters
Recipe programmable sweep movement of dispense arm
Solvent Clean
Application is delivered by a puddle or spray nozzle
Chemicals are delivered from pressurized canisters
Media flow adjustable via flowmeter
Recipe programmable sweep movement of dispense arm
Compatible to most solvents
Some solvents can be applied with high pressure (e.g. NMP, DMSO)
Mechanical substrate cleaning
Brush scrubber – This uses rotating brushes and a pressing force. A special chuck design is used for front and backside scrubbing. A supplementary DI water line is used for rinsing. Smaller brushes are available for treating small pieces.
High pressure – For DI water or solvents. The recipe uses a programmable sweep movement of dispense arm. The pressure is adjustable from 10-180 bar. DI water can be re-ionized with CO2.
Megasonic nozzle – Energy transportation is done by DI water. The recipe uses a programmable sweep movement of dispense arm. The Megasonic can supply from 1 to 5MHz.
HF Clean / Etch
Application is delivered by a puddle nozzle
Chemicals are delivered from a pump (no pressurized canisters)
Chemical flow adjustable via flowmeter
Recipe programmable sweep movement of dispense arm
Metal / Si Etch
Application is delivered by a puddle or spray nozzle
Chemicals mixing via atomizer nozzles or static mixer
Media supply either via pressurized canisters or via pumps
Media flow adjustable via flowmeter
Recipe programmable sweep movement of dispense arm
Compatible with most acids and caustic mixtures
Extended Hot Plate temperature – up to 450°C
The extended high temperature hot plates are implemented to meet the requirements needed in processes such as:
Reflow
Pyrolysis
Final hard bake of protection layers
Temperature controlled chemical lines
When chemicals are supplied from the wafer fab or stored outside the cleanroom the temperatures are different to the cleanroom environment causing chemicals to react and perform differently with changes in temperature. This can result in processing variations. This option can ensure a repeatable temperature level of the chemical’s substrate-to-substrate at point of dispense.
Multiple Chuck solutions – Low contact, Bernoulli
Chuck solutions for etching & cleaning:
Standard wafers that are wet treated use low contact chucks, where the wafer is held in place by supporting pins. and centripetal force fixing it during the high-speed drying.
Squared substrates are held at the corners by alignment pins using low contact chucks. The advantage of this chuck is the entire backside can be rinsed.
If the backside must be protected against aggressive (etching) medias, a Bernoulli chuck can be used. This chuck blows nitrogen which protects the entire backside against chemicals. Alignment pins hold the wafer in place and enables high spin acceleration.
If alignment pins are not allowed, a venturi chuck can be used instead. Nitrogen is injected into the chuck, creating a vacuum in the chuck center by mean of an integrated Venturi nozzle. The nitrogen blows out close to the wafer backside edges. This also protects the wafer backside against chemicals.
Connection to wafer fab Manufacturing Execution Systems
The tool can be configured to enable connection to various Manufacturing Execution System (MES) interfaces such as:
SECS / GEM
OPC/UA
Customer specific interfaces