Products & solutions

Products & solutions

MCT WET Large Substrates

FULLY AUTOMATIC MICRO-CLUSTER TRACK (MCT) TOOL FOR WET ETCHING, DEVELOPING, LIFT-OFF & CLEANING

Obducat’s MCT WET Large Substrates modular tool provides excellent performance as a result of the embedded cutting-edge solutions derived from many years close cooperation with our customers. This ensures that the system is prepared for current and future HVM requirements. The configuration flexibility of the MCT WET Large Substrates makes it adaptable for a wide variety of applications such as Optics, Displays and Advanced Packaging.

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MCT WET Large Substrates

Highlights

  • Suitable for High Volume Manufacturing (HVM)

  • High reliability, yield and uptime

  • Highly configurable tool

  • Customization possible for specific customer process and throughput requirements

Substrate size

System Substrate ⌀ Square substrates
MCTW 600 600 mm 450 mm * 450 mm
MCTW 775 760 mm 540 mm * 540 mm
MCTW 1200 1000 mm 850 mm * 850 mm
MCTW 1500 1400 mm 1000 mm * 1000 mm

Tool Configurations

The standard MCT WET Large Substrates configuration is equipped with an I/O station and an multi axis robot system on a linear track. It can incorporate up to 10 modules configured for Etching, Lift-off, Cleaning, Developing and/or Thermal processing.

The Thermal processing units can be equipped with up to 8 temperature plates in a stacker – hot plates, cool plates & HMDS vapor prime hot plate. The hot plates have a programmable temperature range up to 300°C and are equipped with programmable proximity pins.

  • Easy to operate windows-based PC with 22” color touch screen

  • Unlimited process recipe / flow storage capacity plus USB interface

  • Batch & process parameter tracking

  • Ethernet port

Tool Options

Piranha Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Reaction temperature on wafer > 100°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

  • Hot DI water rinse as an option

SC1 Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Chemical flows for NH4OH, H2O2 and H2O are independently adjustable

  • Heated H2O line to obtain a working temperature of 60° to 70°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

SC2 Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Media flows for HCl, H2O2 and H2O are independently adjustable

  • Heated H2O line to obtain a working temperature of 60° to 70°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

Solvent Clean
  • Application is delivered by a puddle or spray nozzle

  • Chemicals are delivered from pressurized canisters

  • Media flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

  • Compatible to most solvents

  • Some solvents can be applied with high pressure (e.g. NMP, DMSO)

Mechanical substrate cleaning
  • Brush scrubber – This uses rotating brushes and a pressing force. A special chuck design is used for front and backside scrubbing. A supplementary DI water line is used for rinsing. Smaller brushes are available for treating small pieces.

  • High pressure – For DI water or solvents. The recipe uses a programmable sweep movement of dispense arm. The pressure is adjustable from 10-180 bar. DI water can be re-ionized with CO2.

  • Megasonic nozzle – Energy transportation is done by DI water. The recipe uses a programmable sweep movement of dispense arm. The Megasonic can supply from 1 to 5MHz.

HF Clean / Etch
  • Application is delivered by a puddle nozzle

  • Chemicals are delivered from a pump (no pressurized canisters)

  • Media flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

Metal / Si Etch
  • Application is delivered by a puddle or spray nozzle

  • Chemicals mixing via atomizer nozzles or static mixer

  • Media supply either via pressurized canisters or via pumps

  • Media flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

  • Compatible with most acids and caustic mixtures

Multiple Chuck solutions – Low contact

Chuck solutions for Etching & Cleaning:

  • For round substrates that are wet treated the low contact chucks are used, where the substate is held in place by supporting pins and centripetal force fixing it during the high-speed drying.

  • Squared substrates are held at the corners by alignment pins using low contact chucks. The advantage of this chuck is the entire backside can be rinsed.

Temperature controlled chemical lines

When chemicals are supplied from the wafer fab or stored outside the cleanroom the temperatures are different to the cleanroom environment causing chemicals to react and perform differently with changes in temperature. This can result in processing variations. This option can ensure a repeatable temperature level of the chemical’s substrate-to-substrate at point of dispense.

Connection to wafer fab Manufacturing Execution Systems

The tool can be configured to enable connection to various Manufacturing Execution System (MES) interfaces such as:

  • SECS / GEM

  • OPC/UA

  • Customer specific interfaces

Disclaimer: This product page/product description is subject to change without prior notice. Illustrations, photos and specifications on this Site/on this page are not legally binding. Pictures could show standard equipment plus options.