Products & solutions

Products & solutions

QS 200/QS 300 WET

SEMI-AUTOMATIC QUICKSTEP WET (QSW) TOOL FOR WET ETCHING, LIFT-OFF & CLEANING

Obducat’s highly successful QS 200/QS 300 WET platform provides the perfect solution for current and future R&D as well as pilot manufacturing requirements.

The platform flexibility enables the QS 200/QS 300 WET to cover a variety of applications such as LEDs, SiC components, 5G components, Si IC’s, MEMS, Opto-electronic, Photonic components and Advanced Packaging

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Highlights

  • Suitable for R&D and pilot Manufacturing

  • High reliability and low Cost-of-Ownership

  • Highly configurable with a wide variety of options available

  • Process modules are the same as in HVM tools – enables easy migration to volume production

  • Customization possible for specific customer needs

Substrate size

System Substrate ⌀
QSW 200 2” to 8” Ø or 2”x 2” to 6”x 6”
QSW 300 2” to 12” Ø or 2”x 2” to 9”x 9

Tool Configurations

The QS 200/QS 300 WET platform is highly configurable enabling a fit to almost any customer requirements while offering a superior cost efficiency. The tools are built in the materials compatible with the respective customer processes. There are dedicated standard configurations for Photomask Cleaning, Etching, Lift-off and general substrate Cleaning.

The tools are available as stand-alone tools which can be placed next to each other to create a mini-line of processing units.

This versatile tool can also process pieces from broken or damaged wafers. Manual loading and unloading of the substrates are very easy due to the unrestricted access into the process chamber.

For safety purposes an integrated and interlocked automatic process chamber door containing a safety interrupt sensor is standard. A fully automated dry-in, dry-out robot loading is optional

  • Operation control unit with color touch display and windows user interface

  • Unlimited process recipe / flow storage capacity plus USB port

  • Process parameter tracking

  • Ethernet port

Tool Options

Pirahna Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Reaction temperature on wafer > 100°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

  • Hot DI water rinse as an option

SC1 Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of dispense

  • Chemical flows for NH4OH, H2O2 and H2O are independently adjustable

  • Heated H2O line to obtain a working temperature of 60° to 70°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

SC2 Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Chemical flows for HCl, H2O2 and H2O are independently adjustable

  • Heated H2O line to obtain a working temperature of 60° to 70°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

Solvent Clean
  • Application is delivered by a puddle or spray nozzle

  • Chemicals are delivered from pressurized canisters

  • Chemical flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

  • Compatible to most solvents

  • Some solvents can be applied with high pressure (e.g. NMP, DMSO)

Mechanical cleaning
  • Brush scrubber – This uses rotating brushes and a pressing force. A special chuck design is used for front and backside scrubbing. A supplementary DI water line is used for rinsing. Smaller brushes are available for treating small pieces.

  • High pressure – For DI water or solvents. The recipe uses a programmable sweep movement of dispense arm. The pressure is adjustable from 10-180 bar. DI water can be re-ionized with CO2.

  • Megasonic nozzle – Energy transportation is done by DI water. The recipe uses a programmable sweep movement of dispense arm. The Megasonic can supply from 1 to 5MHz.

HF Clean / Etch
  • Application is delivered by a puddle nozzle

  • Chemicals are delivered from a pump (no pressurized canisters)

  • Chemical flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

Metal / Si Etch
  • Application is delivered by a puddle or spray nozzle

  • Chemicals mixing via atomizer nozzles or static mixer

  • Chemical supply either via pressurized canisters or via pumps

  • Chemical flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

  • Compatible with most acids and caustic mixtures

Extended Hot Plate temperature – up to 450°C

The extended high temperature hot plates are implemented to meet the requirements needed in processes such as:

  • Reflow

  • Pyrolysis

  • Final hard bake of protection layers

Temperature controlled chemical lines

When chemicals are supplied from the wafer fab or stored outside the cleanroom the temperatures are different to the cleanroom environment causing chemicals to react and perform differently with changes in temperature. This can result in processing variations. This option can ensure a repeatable temperature level of the chemical’s substrate-to-substrate at point of dispense.

Multiple Chuck solutions – Low contact, Bernoulli Chuck solutions for etching & cleaning:
  • Standard wafers that are wet treated use low contact chucks, where the wafer is held in place by supporting pins. and centripetal force fixing it during the high-speed drying.

  • Squared substrates are held at the corners by alignment pins using low contact chucks. The advantage of this chuck is the entire backside can be rinsed.

  • If the backside must be protected against aggressive (etching) medias, a Bernoulli chuck can be used. This chuck blows nitrogen which protects the entire backside against chemicals. Alignment pins hold the wafer in place and enables high spin acceleration.

  • If alignment pins are not allowed, a venturi chuck can be used instead. Nitrogen is injected into the chuck, creating a vacuum in the chuck center by mean of an integrated Venturi nozzle. The nitrogen blows out close to the wafer backside edges. This also protects the wafer backside against chemicals.

Automatic substrate Load/unload
  • A fully automated dry-in, dry-out substrate load/unload system can be incorporated into the tool.

Connection to wafer fab Manufacturing Execution Systems

The tool can be configured to enable connection to various Manufacturing Execution System (MES) interfaces such as:

  • SECS / GEM

  • OPC/UA

  • Customer specific interfaces

Disclaimer: This product page/product description is subject to change without prior notice. Illustrations, photos and specifications on this Site/on this page are not legally binding. Pictures could show standard equipment plus options.