Products & solutions
Products & solutions
QS WET Large Substrates
SEMI-AUTOMATIC QUICKSTEP (QSW) TOOL FOR WET ETCHING, DEVELOPING, LIFT-OFF & CLEANING
Obducat’s highly successful QS WET Large Substrates platform provides the perfect solution for current and future R&D as well as pilot manufacturing requirements.
The platform flexibility enables the QS WET Large Substrate to cover a variety of applications such as Displays, Optics and Advanced Packaging.
Highlights
Suitable for R&D and pilot Manufacturing
High reliability and low Cost-of-Ownership
Highly configurable with options available
Process modules are the same as in HVM tools – enables easy migration to volume production
Customization possible for specific customer needs
Substrate size
| System | Substrate ⌀ | Square substrates |
|---|---|---|
| QSW 600 | 600 mm | 450 mm * 450 mm |
| QSW 775 | 760 mm | 540 mm * 540 mm |
| QSW 1200 | 1000 mm | 850 mm * 850 mm |
| QSW 1500 | 1400 mm | 1000 mm * 1000 mm |
Tool Configurations
The QS WET Large Substrates platform is highly configurable enabling a fit to almost any customer requirements while offering a superior cost efficiency. The tools are built in the materials compatible with the respective customer processes. There are dedicated standard configurations for Photomask Cleaning, Etching, Lift-off and general substrate Cleaning.
The tools are available as stand-alone tools which can be placed next to each other to create a line of processing units.
Manual loading / unloading of the substrates are very easy due to the unrestricted access into the process chamber and there are optional substrate transport and handling solutions available.
For safety purposes an integrated and interlocked automatic process chamber door containing a safety interrupt sensor is standard. A fully automated dry-in, dry-out robot loading can be optionally added.
- Operation control unit with 22” color touch display and windows like screen
Unlimited process recipe / flow storage capacity plus USB port
- Process parameter tracking
Ethernet port
Tool Options
Piranha Clean
Application is delivered by an atomizer nozzle
Chemicals will be mixed in atomizer nozzle right at the point of use
Reaction temperature on wafer > 100°C
Chemicals are delivered from pressurized canisters
Recipe programmable sweep movement of dispense arm
Hot DI water rinse as an option
SC1 Clean
Application is delivered by an atomizer nozzle
Chemicals will be mixed in atomizer nozzle right at the point of use
Chemical flows for NH4OH, H2O2 and H2O are independently adjustable
Heated H2O line to obtain a working temperature of 60° to 70°C. Upon special request 80°C
Chemicals are delivered from pressurized canisters
Recipe programmable sweep movement of dispense arm
SC2 Clean
Application is delivered by an atomizer nozzle
Chemicals will be mixed in atomizer nozzle right at the point of use
Chemical flows for HCl, H2O2 and H2O are independently adjustable
Heated H2O line to obtain a working temperature of 60° to 70°C. Upon special request 80°C
Chemicals are delivered from pressurized canisters
Recipe programmable sweep movement of dispense arm
HF Clean / Etch
Application is delivered by a puddle nozzle
Chemicals are delivered from a pump (no pressurized canisters)
Medial flow adjustable via flowmeter
Recipe programmable sweep movement of dispense arm
Solvent Clean
Application is delivered by a puddle or spray nozzle
Chemicals are delivered from pressurized canisters
Media flow adjustable via flowmeter
Recipe programmable sweep movement of dispense arm
Compatible to most solvents
Some solvents can be applied with high pressure (e.g. NMP, DMSO)
Metal / Si Etch
Application is delivered by a puddle or spray nozzle
Chemicals mixing via atomizer nozzles or static mixer
Media supply either via pressurized canisters or via pumps
Media flow adjustable via flowmeter
Recipe programmable sweep movement of dispense arm
Compatible with most acids and caustic mixtures
Mechanical substrate cleaning
Brush scrubber – This uses rotating brushes and a pressing force. A special chuck design is used for front and backside scrubbing. A supplementary DI water line is used for rinsing. Smaller brushes are available for treating small pieces.
High pressure – For DI water or solvents. The recipe uses a programmable sweep movement of dispense arm. The pressure is adjustable from 10-180 bar. DI water can be re-ionized with CO2.
Megasonic nozzle – Energy transportation is done by DI water. The recipe uses a programmable sweep movement of dispense arm. The Megasonic can supply from 1 to 5MHz.
Extended Hot Plate temperature – up to 450°C
The extended high temperature hot plates are implemented to meet the requirements needed in processes such as:
Reflow
Pyrolysis
Final hard bake of protection layers
Temperature controlled chemical lines
When chemicals are supplied from the wafer fab or stored outside the cleanroom the temperatures are different to the cleanroom environment causing chemicals to react and perform differently with changes in temperature. This can result in processing variations. This option can ensure a repeatable temperature level of the chemical’s substrate-to-substrate at point of dispense.
Multiple Chuck solutions – Low contact
Chuck solutions for Etching & Cleaning
Round substrates that are wet treated use low contact chucks, where the wafer is held in place by supporting pins.
Square substrates are held at the corners by alignment pins using low contact chucks. The advantage of this chuck is the entire backside can be rinsed.
Temperature controlled chemical lines
When chemicals are supplied from the wafer fab or stored outside the cleanroom the temperatures are different to the cleanroom environment causing chemicals to react and perform differently with changes in temperature. This can result in processing variations. This option can ensure a repeatable temperature level of the chemical’s substrate-to-substrate at point of dispense.
Connection to wafer fab Manufacturing Execution Systems
The tool can be configured to enable connection to various Manufacturing Execution System (MES) interfaces such as:
SECS / GEM
OPC/UA
Customer specific interfaces