Products & solutions

Products & solutions

QS WET Large Substrates

SEMI-AUTOMATIC QUICKSTEP (QSW) TOOL FOR WET ETCHING, DEVELOPING, LIFT-OFF & CLEANING

Obducat’s highly successful QS WET Large Substrates platform provides the perfect solution for current and future R&D as well as pilot manufacturing requirements.

The platform flexibility enables the QS WET Large Substrate to cover a variety of applications such as Displays, Optics and Advanced Packaging.

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Highlights

  • Suitable for R&D and pilot Manufacturing

  • High reliability and low Cost-of-Ownership

  • Highly configurable with options available

  • Process modules are the same as in HVM tools – enables easy migration to volume production

  • Customization possible for specific customer needs

Substrate size

System Substrate ⌀ Square substrates
QSW 600 600 mm 450 mm * 450 mm
QSW 775 760 mm 540 mm * 540 mm
QSW 1200 1000 mm 850 mm * 850 mm
QSW 1500 1400 mm 1000 mm * 1000 mm

Tool Configurations

The QS WET Large Substrates platform is highly configurable enabling a fit to almost any customer requirements while offering a superior cost efficiency. The tools are built in the materials compatible with the respective customer processes. There are dedicated standard configurations for Photomask Cleaning, Etching, Lift-off and general substrate Cleaning.

The tools are available as stand-alone tools which can be placed next to each other to create a line of processing units.

Manual loading / unloading of the substrates are very easy due to the unrestricted access into the process chamber and there are optional substrate transport and handling solutions available.

For safety purposes an integrated and interlocked automatic process chamber door containing a safety interrupt sensor is standard. A fully automated dry-in, dry-out robot loading can be optionally added.

  • Operation control unit with 22” color touch display and windows like screen
  • Unlimited process recipe / flow storage capacity plus USB port

  • Process parameter tracking
  • Ethernet port

Tool Options

Piranha Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Reaction temperature on wafer > 100°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

  • Hot DI water rinse as an option

SC1 Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Chemical flows for NH4OH, H2O2 and H2O are independently adjustable

  • Heated H2O line to obtain a working temperature of 60° to 70°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

SC2 Clean
  • Application is delivered by an atomizer nozzle

  • Chemicals will be mixed in atomizer nozzle right at the point of use

  • Chemical flows for HCl, H2O2 and H2O are independently adjustable

  • Heated H2O line to obtain a working temperature of 60° to 70°C

  • Chemicals are delivered from pressurized canisters

  • Recipe programmable sweep movement of dispense arm

HF Clean / Etch
  • Application is delivered by a puddle nozzle

  • Chemicals are delivered from a pump (no pressurized canisters)

  • Medial flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

Solvent Clean
  • Application is delivered by a puddle or spray nozzle

  • Chemicals are delivered from pressurized canisters

  • Media flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

  • Compatible to most solvents

  • Some solvents can be applied with high pressure (e.g. NMP, DMSO)

Metal / Si Etch
  • Application is delivered by a puddle or spray nozzle

  • Chemicals mixing via atomizer nozzles or static mixer

  • Media supply either via pressurized canisters or via pumps

  • Media flow adjustable via flowmeter

  • Recipe programmable sweep movement of dispense arm

  • Compatible with most acids and caustic mixtures

Mechanical substrate cleaning
  • Brush scrubber – This uses rotating brushes and a pressing force. A special chuck design is used for front and backside scrubbing. A supplementary DI water line is used for rinsing. Smaller brushes are available for treating small pieces.

  • High pressure – For DI water or solvents. The recipe uses a programmable sweep movement of dispense arm. The pressure is adjustable from 10-180 bar. DI water can be re-ionized with CO2.

  • Megasonic nozzle – Energy transportation is done by DI water. The recipe uses a programmable sweep movement of dispense arm. The Megasonic can supply from 1 to 5MHz.

Extended Hot Plate temperature – up to 450°C

The extended high temperature hot plates are implemented to meet the requirements needed in processes such as:

  • Reflow

  • Pyrolysis

  • Final hard bake of protection layers

Temperature controlled chemical lines

When chemicals are supplied from the wafer fab or stored outside the cleanroom the temperatures are different to the cleanroom environment causing chemicals to react and perform differently with changes in temperature. This can result in processing variations. This option can ensure a repeatable temperature level of the chemical’s substrate-to-substrate at point of dispense.

Multiple Chuck solutions – Low contact

Chuck solutions for Etching & Cleaning

  • Round substrates that are wet treated use low contact chucks, where the wafer is held in place by supporting pins.

  • Square substrates are held at the corners by alignment pins using low contact chucks. The advantage of this chuck is the entire backside can be rinsed.

Temperature controlled chemical lines

When chemicals are supplied from the wafer fab or stored outside the cleanroom the temperatures are different to the cleanroom environment causing chemicals to react and perform differently with changes in temperature. This can result in processing variations. This option can ensure a repeatable temperature level of the chemical’s substrate-to-substrate at point of dispense.

Connection to wafer fab Manufacturing Execution Systems

The tool can be configured to enable connection to various Manufacturing Execution System (MES) interfaces such as:

  • SECS / GEM

  • OPC/UA

  • Customer specific interfaces

Disclaimer: This product page/product description is subject to change without prior notice. Illustrations, photos and specifications on this Site/on this page are not legally binding. Pictures could show standard equipment plus options.