Wet etch processes are used in device formation as well as in the metallization and packaging processes. Our dedicated Etch modules enables optimized high purity etch-chemistries to selectively remove, in a fast and  cost-effective way, material uniformly across an entire substrate surface. Oxide removal after a photolithographic step, stress relief after wafer grinding, wafer thinning and surface texturing are some of the targeted process steps that are performed with industry leading low particle level as a result.