Lift-Off is a critical process step that can be used to create three-dimensional metal interconnects surrounded by air, known as air bridges, as well as to enable the deposition of metals such as Au, Ta and Ti that are not easily etched using traditional plasma or wet chemical processes. Our dedicated modules for Lift-off processesing offers state-of-the-art process control over existing batch methods, eliminating errors in device manufacturinge by preventing metal redeposition back onto the substrates. Furthermore, single wafer dry in/dry out processes allow improved process control and tuning to accommodate various metal and resist film stacks.