NanoImprint Lithograhy (NIL)

Based on our patented NIL-technology, Obducat has created a process suitable for replication of extremely accurate micro- and nanosized structures from a master stamp onto a target substrate which can be anything from a flexible polymer film to a hard-sapphire substrate. Our technology also enables us to replicate patterns and structures onto non-flat substrates, such as camera lenses with concave or convex surfaces.

All our NIL-systems perform Full Area Imprint, meaning that the entire surface is replicated in one single step and not in several smaller steps which is common in many competing solutions.

In the Obducat process developed for High Volume Manufacturing purposes, the patterns are replicated from a master stamp onto a polymer film. The polymer film, which we call Intermediate Polymer Stamp (IPS®), with the patterns transferred from the master stamp is then used to replicate the patterns onto the target substrate. In this final replication onto the target substrate, we use a Simultaneous Thermal and UV (STU®) process which eliminates thermal expansions and thereby increases the quality and repeatability of the pattern transfer. The IPS®-technology reduces the wear on the master stamp and decreases the number of defects caused by particle contamination which increases the overall cost efficiency of the Obducat NIL-process approach.

Obducat’s patented technology, Soft Press®, in combination with the IPS®, enable the patterns to be transferred with an even pressure over large substrate sizes – a key element of the NIL-technology.

Obducat’s patented NIL technologies offers industry leading Cost-of-Ownership and performance.

Obducat’s NIL Process Technologies

IPS® – Intermediate Polymer Stamp

The patented IPS® technology is based on making a replication of the master stamp into a soft Intermediate Polymer Stamp (IPS®). The IPS® is then used in a second imprint step to transfer the structures onto the target substrate. The IPS® enables contamination control, increases the master stamp lifetime and makes the imprint process less sensitive to substrate contaminations and surface roughness.


With Obducat’s patented SoftPress® technology, the imprint pressure is applied using compressed gas, ensuring pressure uniformity over the entire imprint area. This allows the stamp or IPS® to conform to the substrate, eliminating negative effects from thickness variations, bow or waviness. SoftPress® enables thin and uniform residual layer across the substrate, which is critical for enabling high-resolution imprinting and pattern transfer fidelity.

STU® – Simultaneous Thermal and UV

The patented STU® technology combines, in one imprint sequence, the simultaneous use of thermal- and UV based imprint processes. The STU® process allows for increased polymer flow rate giving a shorter process time as well as enabling improved material compatibility and thereby a wider selection of workable imprint materials.

Automated IPS® demolding

The patented automated demolding function developed by Obducat for use with the patented IPS® and SoftPress® technologies makes the demolding of the IPS® material accurate and repeatable, ensuring that the pattern fidelity is kept at the highest possible level as well as preserving the stamp from any manual handling during the imprint sequence.